At Manncorp, we've always been committed to evolving alongside the needs of the electronics manufacturing industry. What started with basic pick and place machines has grown into a powerful lineup of high-speed systems, with models offering 6 to 8 placement heads and over 20,000 components per hour (CPH). But the future is here—and it's smaller, faster, and more precise.

We're proud to introduce our latest innovation: Manncorp's wafer handling microelectronics line, developed as part of our initiative to support the reshoring of manufacturing and strengthen domestic supply chains. This is the next big growth area in electronics production, and we've built the equipment to meet it head-on.

Microelectronics: Precision from Wafer to Lead Frame

In microelectronics, it's not just placing components on PCBs—we're working at the die level. The process starts by picking bare dies directly from a wafer—the same wafers that contain the building blocks of integrated circuits. From there, the dies are precisely placed into lead frames or substrates, forming the foundation for advanced semiconductor devices.

This level of precision demands a new generation of equipment—machines purpose-built for wafer handling, die bonding, and integrated circuit assembly. It's a major step forward in both capability and complexity, and Manncorp is proud to offer the tools and support to help you take it on.

Introducing the WH Series: Wafer Handling by Manncorp

Our new WH line of wafer handling equipment is designed primarily to meet the needs of microelectronics manufacturing. This new generation of machines is built specifically for integrated circuit assembly, capable of extracting and placing components directly from wafers.

Whether you're working on early-stage prototypes or preparing for small-scale production runs, the WH Series provides the precision and flexibility required for today's cutting-edge microelectronics work.

Die Attach Made Simple: The HPX1S

In addition to wafer handling, Manncorp also offers the HPX1S Die Attach Machine—ideal for high-accuracy, low-volume die bonding. With 3 CCD cameras and a bottom alignment camera, the HPX1S ensures accurate placement of die sizes ranging from 1.4 x 1.4 mm to 7 x 7 mm.

It's a perfect fit for applications like:

• Prototyping
• On-demand production
• Custom low-volume runs
• R&D and lab settings

Plus, customization options are available to match the unique demands of your operation.

Supporting Innovation in the U.S.

We've built these machines to support small to medium-sized R&D companies—especially those working in sensitive, high-end sectors like defense, government, and academic research. While larger corporations may require fully scaled-up production systems, our microelectronics equipment provides R&D teams with the perfect balance of capability and precision for confidential, mission-critical work.

If your company is part of the wave of U.S.-based innovation in semiconductors and microelectronics, Manncorp has the tools to help you build it here—faster and smarter.

Looking for more information? Reach out to Chris (215.869.8374) or Ed (215.808.6266) to get started.