Operation is quick and easy. Simply align the V-groove with the extended lower guide. Lock the upper blade to the exact thickness of the PCB. The motorized lower blade transports and cuts the board while the upper "coasting" blade acts as a guide to maintain proper alignment along the pre-scored groove. SDM223 can separate densely-populated panels up to 400 mm (15.7") long with components located as close as 1 mm to the V-groove. Separating speeds are adjustable from 0 to 350 mm/sec (13.8"/sec) to provide the optimum balance of performance and throughput for each job.
SDM223 SPECIFICATIONS | |
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PCB Thickness | 1.0 mm to 3.0 mm |
Maximum Depaneling Length | 400 mm (15.7") |
V-Scoring Lines Specs: |
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Depaneling Mode | Motorized |
Separating Speed | Adjustable from 0 to 350 mm/sec (13.8"/sec) |
Production Rate | Low to moderate volume |
Scoring Angle | 20Ëš |
Minimum Component Distance from V-Groove | 1 mm |
Maximum Component Height | 32 mm (1.26") |
PCB Materials | FR4, CEM3, etc. |
Power | 110 V, 60 Hz 1.6 A |
Dimensions (L x W x H) | 260 mm x 653 mm x 346 mm (10.2" x 25.7" x 13.6") |
Net Weight | 48 kg (106 lbs) |
Shipping Weight | 73 kg (161 lbs) |
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