SDM236 LED Depaneler

LED Depaneling Machine - SDM236 from Manncorp
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies
SDM236 for Depaneling LED Boards/Assemblies

SDM236 LED Depaneler

The SDM236 LED Depaneler has been specially designed to separate extra-long, V-grooved, aluminum panels and thick FR4 PCBs that are often difficult to cut.

With PCB support platforms (standard) installed on opposite ends of the depaneler for loading and unloading, the entire system is more than 2.3 meters (91") long and allows more than ample space for handling long 1.2 m (48") substrates commonly used in the manufacture of LED lighting products. The platforms can also accommodate a 370 mm (14.5") panel width for even greater versatility and throughput.

Regular price $8,495.00
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QUESTIONS? TEXT OR CALL:
Chris Ellis  215-869-8374 | East Coast
Ed Stone 215-808-6266 | West Coast

The SDM236 has three circular and motorized cutting blades capable of separating v-grooved aluminum boards with an overall thickness from 0.8 mm to 1.6 mm (0.03"-0.06") or FR4 PCBs with an overall thickness from 0.8 mm to 3.0 mm (0.03"-0.12"). Due to its unique design (3 sets of blades and separate cutting stages), the distance between the blades and the progressive depth of each cut can be set independently. In conjunction with a blade speed/cutting speed that is variable from 0-500 mm/s (0-20/s) to suit the particular application, inordinate stress on the substrate and components is eliminated and blade wear is minimized.

The SDM236 is suited for medium to high-volume production and can separate individual strips up to 55 mm (2.16") wide with components up to 15 mm tall that are as close as 2 mm to the score line. The guide bar, height of the landing table, and the height of the center of the platform can also be adjusted accordingly to ensure quick and precise alignment of the score lines into the cutting blades.

SDM236 SPECIFICATIONS
PCB Thickness 0.8 mm to 1.6 mm (AL); 0.8 to 3.0 mm (FR4)
Maximum Depaneling Length Unlimited
Maximum PCB Dimension 55mm
V-Scoring Lines Specs:
  • Depth of scoring (A): ≥ 0.3 mm max (AL);
    ≥ 0.8 mm max (FR4)
  • Remaining PCB thickness (B): 1.0 mm max (AL);
    1.4 mm max (FR4)
  • Component from scoring (C): ≥ 2 mm
  • Scoring angle θ: ≥ 30Ëš (typical)
  • Max. component height (D): 15 mm
Depaneling Mode Motorized
Separating Speed 0 - 500 mm/s
Production Rate Moderate to high volume
Scoring Angle 30Ëš
Minimum Component
Distance from V-Groove
2 mm
Maximum Component Height 15mm from the loading platform
PCB Materials Aluminum or FR4
Processing Table 500 x 165 mm (19.7" x 6.5")
Dimensions (L x W x H) 59" x 10.6" x 7.85"
Depaneler: 15.75" x 15.75" x 13"
Loading Platform: 28.4" x 14.6" x 7.9"
Unloading Platform: 47.2" x 14.6" x 7.9"
Net Weight 40 kg (88 lbs)
Shipping Weight 75 kg (165 lbs)

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