Even when metaled circuit boards are processed – such as those populated with heat-generating LEDs that require heat-dissipating metal inner layers – this machine will easily make the cut.

SDM313 also cuts flexible and ultra-thin PCBs (down to 0.5 mm thick) clean, with no ripping or tearing, even when sensitive components such as delicate ceramic capacitors, are mounted within 0.5 mm of the score line. The linear, rather than circular, cutting surfaces allow for faster separations without added stress.

Alignment between the SDM313's linear cutting blades and the panel's score line is achieved using a knob at the top of the machine. The narrow separation between the upper and lower blades (a maximum of 4 mm) protects the operator from the blade edges.