Precision & Alignment Technology

Built for semiconductor-grade accuracy, the WH385V1V utilizes a high-precision ball screw drive with rotary encoders to ensure 30 µm placement accuracy (3 Sigma). The system's dual-vision alignment uses a head-mounted Cognex^® on-the-fly camera for micron-level placement of microchips and dies, while a base-mounted upward vision system supports handling of larger components like IC packages and interposers.

Flexible Component Handling

The WH385V1V supports handling of microelectronic dies, wafers, and packaged devices ranging from 01005 passives to large ICs up to 100 x 150 mm. The system integrates tape, tray, stick, and loose component support, enabling advanced hybrid assembly processes with flexible material formats. Ideal for labs and fabs working with advanced packaging, MEMS, and multi-chip modules.

Feeder Configuration & Throughput

Up to 128 feeder ports allows continuous loading of devices from various input methods including tape, stick, and waffle trays—minimizing downtime and supporting high-mix workflows. With its smart feeder architecture, the WH385V1V enables fast changeover and error-proof setup, ideal for short runs or R&D environments. Placement throughput reaches 5,000 components per hour.

Platform Design & Integration

A rigid, steel unibody chassis minimizes vibration and maintains precision at high speeds, while SMEMA-compatible conveyor options allow inline integration into semiconductor production lines or standalone use. Whether used for prototyping or volume production, its modular options and optional dispensing head make it adaptable to a wide range of assembly requirements, including epoxy and solder paste dispensing for die attach.