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Built for Wafer-Level Productivity
The WH388 supports batch or inline configurations, delivering fast, accurate placement for bare dies, flip chips, micro components, and more:
- +/- 30 µm, 3 Sigma handling accuracy
- Four-head gantry for parallel processing
- Supports component sizes from 01005 to 100 x 150 mm
- Cognex® dual-vision system for high-precision alignment (on-the-fly and bottom vision)
- Full lead/bump/pad alignment for ultra-fine pitch ICs and custom die patterns
Massive Feeder & Tray Capacity
With support for up to 256 Smart Feeders in batch mode (or 192 feeders inline), the WH388 drastically reduces job changeover time—perfect for multi-product wafer-level or hybrid assembly.
- Placement area up to 1200 x 408 mm (47.2” x 16”) in batch mode
- Inline placement area of up to 1200 x 370 mm (47.2” x 14.6”), shared across PCBs, wafer trays, gel packs, and waffle packs
- Supports custom tooling, cut strip feeders, die presentation media, and advanced IC packaging requirements
Configurable Conveyor & Handling Options
Adapt the WH388 to your line and application:
- Standard 3-stage SMEMA inline conveyor with an auto width control (PCBs up to 650 mm wide)
- Optional single-stage 1.2 m conveyor for long-format substrates (LEDs, backplanes, panelized wafers)
- Optional dual-stage conveyor extends length handling to 1.5 meters
- Batch/standalone mode enables full feeder and tray usage for wafer-level jobs
Powerful Software for Complex Jobs
The WH388 runs on Manncorp's Windows®-based control platform—refined over a decade of real-world use in high-mix production environments. It's optimized for semiconductor packaging and wafer-level assembly.
- CAD, ASCII, and AutoCAD data import
- Virtual layout simulator for visual verification of placement, orientation, and clearances
- Component and wafer map libraries for standard and custom formats
- Smart Feeder integration for job setup, inventory control, and real-time status
- Optimization tools for efficient head travel and tool changes
- Fiducial recognition and offset correction
- Optional dispensing head for bonding agents or adhesives
- Remote diagnostics for fast support
Ideal for:
- Wafer-level packaging (WLP)
- Multi-die module assembly
- MEMS and sensor integration
- Panelized microelectronics
- Hybrid IC packaging
- LED substrates and long-format boards
| Placement Specifications | |
|---|---|
| Number of Placement Heads | 4 |
| Placement Rate (IPC-9850)* | 8,000 CPH |
| Placement Rate (Max.) | 10,500 CPH |
| Placement Accuracy | 30 µm, 3 Sigma |
| Minimum Component Size | 01005 |
| Maximum Component Size | 100 mm x 150 mm (3.94" x 5.9") |
| Maximum Component Lead Pitch | 0.3 mm (0.012") |
| BGA/CSP Placement Capability | Yes - Standard |
| Alignment Method | Dual-Vision Alignment System |
| Wafer Handling | 8-in Wafer Holder |
| Pick Up Specifications | |
| Nozzle Changer | Included |
| Number of Nozzles | 22 |
| Accepts Additional Nozzles | Yes |
| Integral Vacuum | Yes |
| PCB Specifications | |
| PCB Loading Method | 3-Stage Inline Single-Lane Conveyor standard. Dual lane, single stage and dual stage available as well as no conveyor (batch / standalone operation) |
| Maximum Placement Area | 350 mm x 1250 mm (13.7" x 49.2") w/ conveyor 410 mm x 1100 mm (43.3" x 16") w/o conveyor |
| Fiducial Recognition/ Coordinate | Yes |
| Bad Mark Detection | Yes |
| Feeder Capacity | |
| Maximum Number of Feeder Ports | 192 w/inline conveyor 256 w/batch configuration |
| Programming | |
| Operating System | Windows Based |
| PC, Keyboard, Mouse | Yes |
| Monitor | Flat LCD |
| Teaching Camera | Yes |
| Numeric Data Entry | Yes |
| CAD Download | Yes |
| Step and Repeat for Matrix Boards | Yes |
| Bar Code Reader for Feeders & Packaging | Yes |
| MIS and Optimization Functions | Yes |
| Off-Line Programming | Yes |
| Dispenser Specifications | |
| Dispensing Head | Optional |
| Dispense Method | Time/Pressure |
| Dot Size/Placement Speed | Down to 0.5 mm |
| Mechanical Specifications | |
| X-Y Axis Drive Mechanism | Ball Screw |
| X-Y Axis Drive Motors | AC Servo |
| X-Y Axis Encoding | Rotary |
| X-Y Axis Resolution | 0.005 mm (0.0002") |
| Z Axis Drive Motor | DC Servo |
| Z Axis Encoding | Rotary |
| Z Axis Resolution | 0.02 mm (0.0008") |
| θ Axis Drive Motor | DC Servo |
| θ Axis Encoding | Rotary |
| θ Axis Resolution | 0.045° |
| θ Axis Range of Motion | 360° |
| Physical Specifications | |
| Overall Dimensions (Approx. L x W x H) | 2040 mm L x 1530 mm W x 1486 mm H (80" x 60" x 58") |
| Approx. Net Weight | 1200 Kg (2646 lbs.) |
| Facility Requirements | |
| Standard Voltage | 200-230 VAC, 50/60 Hz, 7A |
| Air Pressure | 80 psi, 16 CFM |
| Service and Support | |
| Remote Diagnostics | Ethernet |
| Warranty (Major Components) | 1 Year |
