Precision Placement with Wafer-Level Handling

Designed to meet the demands of microelectronics, the WH400 offers ±50 µm placement accuracy with ±10 µm repeatability. Its Cognex^® dual-camera vision system handles everything from µBGAs and flip chips to large, irregular dies up to 100 x 150 mm. The integrated wafer handler ensures accurate pickup of known-good-die directly from wafer frames or gel packs, streamlining die attach and reducing handling steps.

Optimized for Low-Volume, High-Mix Environments

Supporting up to 64 feeder inputs—including smart feeders, cut strip holders, and manual loading—the WH400 is ideal for high-mix, short-run jobs where component availability and setup time are critical. It can operate with loose components or cut tape to minimize waste during prototyping. Throughput reaches up to 2,500 CPH, with software-driven optimization for feeder layout and head movement.

Simple, Scalable Software

The WH400 runs on the same proven Windows®-based software as the rest of the WH and MC families. Operators benefit from CAD import, virtual simulation, teach-in programming, and fiducial-based correction for repeatable results. Smart feeder recognition and part library integration streamline setup and job execution.

Built to Grow with You

Whether you're in an R&D lab, an academic cleanroom, or a pilot production facility, the WH400 gives you room to expand. Its full compatibility with Manncorp's WH and MC ecosystem means that as your volume increases, your process and training remain consistent—no software gaps, no retraining, and no wasted investment.