Back
Description
Protect_msd
Restore_and_store
Specifications
Features
Feeders
Machine_configurations
Applications
Profile_predictions
Performance_charts
Video
Navigator_software
Process_window
Add_ons
Temperature_tolerance
Includes
Add_fluxing
Contact
Dual Vision System for Maximum Flexibility
The WH889 features an advanced "Vision on the Fly" optical centering system, allowing it to accurately inspect and align components while in motion. This eliminates the bottleneck of stationary measurement, optimizing process flow.
- On-head vision handles components from 01005 to 16 x 14 mm, using a built-in camera and prism system
- Bottom-vision camera enables high-precision placement of large or complex packages up to 100 x 150 mm, including QFPs, CSPs, µBGAs, and more
- Full lead/bump/pad inspection for fine-pitch and non-standard ICs
- Ideal for semiconductor-level component placement, including bare die, MEMS, and flip-chip packages
Ultra-High Speed Placement
With up to 22,000 CPH, the WH889 balances throughput with micron-level precision:
- WH889 standard: 20,000 CPH
- WH889 8-head version: 22,000 CPH
- ±30 µm @ 3 Sigma placement accuracy
- Highly stable placement for even the smallest components: 01005, µBGAs, CSPs, and odd-form die
Configurable Feeder and Tray Handling
The WH889 supports high-density feeder configurations and multiple presentation formats for wafer and IC packaging environments:
- Up to 96 automatic tape feeders (8mm width)
- Support for up to 3 waffle trays or gel packs (with optional tray holders)
- Full 650 x 440 mm placement area without tray holders
- Optimized for mixed presentations: dies in tape, trays, or custom packaging formats
Windows®-Based Control Software for Seamless Integration
The WH889 runs on a proven, Windows® 10-based software platform optimized for high-mix, high-speed semiconductor applications. Its intuitive interface and broad compatibility minimize training time and streamline setup.
- Teach-In or CAD import for rapid program creation
- Built-in fiducial recognition and offset correction
- Virtual preview of placement sequence and alignment
- Integrated with Smart Feeder software for inventory management and setup validation
Built for:
- Wafer-level die placement
- Multi-chip module (MCM) and SIP packaging
- µBGA, QFN, and CSP assembly
- MEMS, sensor, and passive integration
- High-volume microelectronics production
| Placement Specifications | |
|---|---|
| Number of Placement Heads | 6 or 8 |
| 6 Head Placement Rate (IPC-9850)* | 20,000 CPH, 18,500 CPH |
| 8 Head Placement Rate (IPC-9850)* | 22,000 CPH, 20,000 CPH |
| Placement Accuracy | ± 0.03 mm |
| Minimum Component Size | 01005 |
| Maximum Component Size | 100x150 mm |
| Maximum Component Lead Pitch | 0.3 mm (0.012") |
| BGA/CSP Placement Capability | Yes - Standard |
| Alignment Method | Dual-Vision Alignment System |
| Wafer Handling | 8-in Wafer Holder |
| Pick Up Specifications | |
| Nozzle Changer | Included |
| Number of Nozzles | 32 or 42 6 or 8 Head |
| Accepts Additional Nozzles | Yes |
| Integral Vacuum | Yes |
| PCB Specifications | |
| PCB Loading Method | 3-stage inline conveyor (optional) |
| Maximum Placement Area | 650 x 440 mm (25.6" x 17.3") w/ conveyor |
| Fiducial Recognition /Coordinate Correction | Yes |
| Bad Mark Detection | Yes |
| Feeder Capacity | |
| Maximum Number of Feeder Ports | 96 with inline conveyor |
| Maximum Number of Waffle Trays | Dependent on PCB size |
| Programming | |
| Operating System | Windows® Based |
| PC, Keyboard, Mouse | Yes |
| Monitor | Flat LCD |
| Teaching Camera | Yes |
| Numeric Data Entry | Yes |
| CAD Download | Yes |
| Step and Repeat for Matrix Boards | Yes |
| Bar Code Reader for Feeders & Packaging | Yes |
| MIS and Optimization Functions | Yes |
| Off-Line Programming | Yes |
| Mechanical Specifications | |
| X-Y Axis Drive Mechanism | Ball Screw |
| X-Y Axis Drive Motors | AC Servo |
| X-Y Axis Encoding | Rotary |
| X-Y Axis Resolution | 0.005 mm (0.0002") |
| Z Axis Drive Motor | AC Servo |
| Z Axis Encoding | Rotary |
| Z Axis Resolution | 0.01 mm (0.0004") |
| θ Axis Drive Motor | DC Servo |
| θ Axis Encoding | Rotary |
| θ Axis Resolution | 0.09° |
| θ Axis Range of Motion | 360° |
| Physical Specifications | |
| Overall Dimensions (Approx. L x W x H) | 1340 x 1480 x 1454 mm (53" x 58" x 57") |
| Approx. Net Weight | 1100 kg (2425 lbs.) |
| Facility Requirements | |
| Standard Voltage | 220 VAC, 3 Phase, 30 Amps |
| Air Pressure | 75 psi, max 500L/min |
| Service and Support | |
| Remote Support | Yes |
| Warranty (Major Components) | 1 Year |
