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Highly Accurate and Stable
With an XY repeatability of ± 1.5μm and an XY placement accuracy of ± 25μm, this is a highly precise die attach machine that can be trusted to help your company produce high-quality semiconductor chips. The 8" magnetic waffle frame allows the machine to pick die attach components from size 1.4 x 1.4 mm to 7 x 7 mm.
Great for Low Volume, Prototype, and Custom Applications
The high level of accuracy performed by this die attach machine makes it a perfect solution for prototyping, lab settings, low-volume assembly, on-demand production, and custom applications.
Easy Programming
The software on this equipment is Windows 7, ensuring a short learning curve for operators. Different methods are available for programming, tailoring the machine to your needs with Teach-In and Matrix Data Input systems.
| HPX1S Die Attach Specifications | |
|---|---|
| XY Repeatability | ± 1.5μm |
| XY Placement Accuracy | ± 25μm |
| R Rotation Accuracy | ±0.3° |
| PCB Holding | Vacuum with Sensor |
| Working Table Area | max 9.84" x 9.84" (250 x 250 mm) |
| Wafer Frame Size | 8" (Outer Dimension 296mm) |
| Component Size | 1.4 x 1.4 mm – 7 x 7 mm |
| Camera System | CCD x 3 Sets |
| Camera Resolution | 1.3 M & 3 M |
| Component Alignment | Digital Bottom Camera |
| Production Rate | 1100 UPH |
| Storage | 120GB SSD and 1TB HDD Back up |
| Air Requirement | 80 psi (5.5bar) @ 150 Liter/min. |
| Grip Ring Handler | For Wafer Ring |
| Ejector | Pin Ejector |
| Power Requirement | 200-230 VAC, 50-60Hz, 1.5kW |
| Dimensions (LxWxH) | 35.8” x 59” x 71.6” (910 x 1500 x 1820 mm) |
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