Ideal for Labs, Small-Scale Production, Schools, Prototyping, and More.

Measuring only 789 mm L x 742 mm W x 483 mm H (31" x 29" x 19") and weighing under 125 kg, the MC302 easily installs on virtually any benchtop. Its ability to simulate inline reflow profiles with preheat, soak, reflow, and cooling phases makes it a great choice for labs or other installations where space is often at a premium. The front-loading heating chamber has an effective soldering area of 320 mm x 220 mm and includes a window for viewing of the soldering process.

Full Hot-Air Soldering Processing

The new generation MC302 Benchtop Convection Reflow Oven is equipped with a full hot air convection system. Hot air is spread evenly to every corner of the PCB board, avoiding shadow effects and color sensitives to temperature sensing deviation and making the heating efficiency of components consistent.

Built-In Dual Core CPU Based Control Application

The MC302 CPU based control app provides an easy to use, 7" touch-panel interface with virtual keyboard for setting the temperature and duration of the preheat, soak, reflow, and cooling stages. In the reflow zone, the user can specify the dwell at both the melting and peak temperatures. Based on these settings, the system will also automatically calculate the heating or cooling rate in each stage for verification with solder paste and component manufacturer's specifications. In addition, when heater control is based on the higher temperature measured at the heaters, the system displays the calculated board temperature based on a calibrated offset.

The real-time temperature profiles are created either by the oven or via the PCB temperature and displayed during the process cycle. The actual values can be easily compared with the set values, which enables precise parameter setting.

Process data and profiles can be saved or printed via WIFI connection and used for training, development, quality control, and tracking purposes.

Real-Time Dynamic Thermal Control Via On-Board Measuring

The MC302 Benchtop Convection Reflow Oven has an advanced setting in which you can turn on the real-time dynamic process. The unit can then adjust via real-time feedback from the measuring system which is attached at a strategic location on the PCB surface. The heater control and fan speed are based on the actual temperature measured on the product. The target temperature is equal to the dynamic measuring system temperature and there is no offset, making this a perfect tool for prototyping and small series.

Simulated Multi-Zone Temperature and Time Setting

The MC302 series reflow oven is available to set up the dynamic curve by a maximum of 9 points of temperature and timing simulated to the heating process of a multi-zone reflow oven.