WH389 Wafer Handler

WH389 Wafer Handler
WH389 Wafer Handler
WH389 Wafer Handler
Front View: SMT Pick and Place MC389 for High-Speed, High Mix PCBA
WH389 Wafer Handler
SMT Pick and Place MC389 for High-Speed, High Mix PCBA from Manncorp
MC389's 3 Pick & Place Heads
MC389 Feeder Rack & On-the-Fly Vision Cameras
Close-up of MC389 Feeder Rack
MC389 Bottom Vision Camera and Pick Up Nozzles
MC389 with PCB Shown on Conveyor
MC389 SMT Pick & Place Machine Shown with Covers Open - Front View
MC389 SMT Pick & Place Machine Shown with Covers Open - Rear View
MC389 Pick & Place Heads and On-the-Fly Cameras Gantry
MC389 Pick & Place Machine Interior
MC389 Pick & Place Machine Ports

WH389 Wafer Handler

The WH389 sets a new benchmark for wafer handling performance, precision, and flexibility in semiconductor manufacturing. Built on Manncorp's proven ball-screw and rotary-encoded drive system, the WH389 features a triple-head gantry and advanced vision alignment for high-speed, high-accuracy wafer and die processing. Ideal for microelectronics and IC packaging applications, it handles delicate components such as bare dies, µBGAs, and ultra-fine pitch ICs with ease.

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Questions? Reach Out Directly:

Chris Ellis - East Coast

Sales & Operations Manager

215.869.8374

Ed Stone - West Coast

Sales Manager

215.808.6266

Engineered for Speed, Accuracy, and Stability

The WH389 delivers unmatched handling precision and consistent throughput in a high-mix production environment, with:

  • +/- 30 µm, 3 Sigma placement accuracy
  • High-precision ball-screw X/Y drive with rotary encoders
  • Closed-loop servo control on all axes
  • Rigid, vibration-dampening unibody steel frame
  • Triple-head gantry for optimized parallel processing
  • Up to 10,500 components per hour (IPC-9850)

Flexible Wafer & Die Handling Capabilities

Dual-vision alignment combines Cognex® on-the-fly and bottom stationary vision for fast, accurate die placement, wafer-level packaging, and micro-assembly. The WH389 includes:

  • Ball inspection and missing ball detection
  • Support for nonstandard and custom die layouts
  • 23-position automatic tool changer with 17 standard nozzle types

Tooling & Feeder Adaptability

With a handling area of up to 650 mm x 460 mm (25.6" x 18.1"), the WH389 can be configured for a wide range of applications. The system accommodates:

  • Up to 160 Smart Tape and Stick Feeders
  • Wafer trays, gel packs, and waffle packs
  • Feeder racks (front, back, and sides) with support for mixed formats
  • Optional cut strip feeders and tray-based IC handling

Seamless Programming & Operation

The WH389 supports modern semiconductor workflows with:

  • UCAD® (universal CAD) import from ASCII, AutoCAD, and Excel formats
  • Onboard fiducial teaching camera
  • Virtual PCB/IC Layout Simulator for verifying orientation and placement before production
  • Smart Feeder compatibility for fast setup and efficient changeovers

Inspection & Inventory Tools

Enhance traceability and quality control with:

  • Integrated vision inspection for die placement and paste printing
  • Optional barcode scanning for lot codes, dates, and quantities
  • Offline feeder programming to reduce downtime

*Note: 2D barcodes on component reels are not readable by the software. 

Placement Specifications
Number of Placement Heads 3
Placement Rate (IPC-9850)* 10,500 CPH
Placement Accuracy 30 µm, 3 Sigma
Minimum Component Size 01005
Maximum Component Size 100 mm x 150 mm (3.94" x 5.9")
Minimum Component Lead Pitch 0.3 mm (0.012")
BGA/CSP Placement Capability Yes - Standard
Alignment Method Dual-Vision Alignment System
Wafer Handling 8-in Wafer Holder
 
Pick Up Specifications
Nozzle Changer Included
Number of Nozzles 17
Accepts Additional Nozzles Yes
Integral Vacuum Yes
 
PCB Specifications
PCB Loading Method Manual loading in batch / standalone configuration (standard) 
Single-stage and 3-stage inline conveyors (optional)
Maximum Placement Area 650 x 380 mm (25.6" x 15") 
with conveyor 
650 x 460 mm (25.6" x 18.1") 
without conveyor
Fiducial Recognition / Coordinate Correction Yes
Bad Mark Detection Yes
 
Feeder Capacity
Maximum Number of Feeder Ports 96 with inline conveyor 
160 batch configuration w/ feeders on four sides
Maximum Number of Waffle Trays Dependent on PCB size
 
Programming
Operating System Windows® Based
PC, Keyboard, Mouse Yes
Monitor Flat LCD
Teaching Camera Yes
Numeric Data Entry Yes
CAD Download Yes
Step and Repeat for Matrix Boards Yes
Bar Code Reader for Feeders & Packaging Yes
MIS and Optimization Functions Yes
Off-Line Programming Yes
Dispenser Specifications
Dispensing Head Optional
Dispense Method Time/Pressure
Dot Size/Placement Speed Down to 0.5 mm 
Up to 6,000 dots/hr
 
Mechanical Specifications
X-Y Axis Drive Mechanism Ball Screw
X-Y Axis Drive Motors AC Servo
X-Y Axis Encoding Rotary
X-Y Axis Resolution 0.005 mm (0.0002")
Z Axis Drive Motor DC Servo
Z Axis Encoding Rotary
Z Axis Resolution 0.02 mm (0.0008")
θ Axis Drive Motor DC Servo
θ Axis Encoding Rotary
θ Axis Resolution 0.045°
θ Axis Range of Motion 360°
 
Physical Specifications
Overall Dimensions (Approx. L x W x H) 1340 x 1478 x 1470 mm 
(52.7" x 58" x 57")
Approx. Net Weight 1100 kg (2425 lbs.)
 
Facility Requirements
Standard Voltage 200-230 VAC, 50/60 Hz
Air Pressure 80 psi, 9 CFM
 
Service and Support
Remote Diagnostics Included
Warranty (Major Components) 1 Year

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MC389 Mid-High Volume Pick & Place
  • 10,500 CPH, Three Head
  • Up to 160 Smart Feeder Ports
  • PCBs to 650 x 460 mm
$195,995.00
MC388 Mid-High Volume Pick & Place
  • 10,500 CPH, Four Head
  • Up to 256 Smart Feeder Ports
  • PCBs to 1250 x 350 mm
$249,995.00
MC889 High Speed Pick & Place
  • 20,000/22,000 CPH, 6/8 Head
  • Up to 96 Smart Feeder Ports
  • PCBs to 650 x 460 mm
from $279,995.00
MC388HS High Speed Pick & Place
  • 18,000/22,000 CPH, 6/8 Head
  • Up to 192 Smart Feeder Ports
  • PCBs to 1250 x 350 mm
from $284,995.00
MC385V2V Mid-Volume Pick & Place
  • 8,000 CPH, Dual-Head
  • Up to 128 Smart Feeder Ports
  • PCBs to 435 x 350 mm
$154,995.00