WH392 Wafer Handler

SMT Pick and Place - MC392 Handles High Component Mix from Manncorp
WH392 Wafer Handler
WH392 Wafer Handler
WH392 Wafer Handler
WH392 Wafer Handler
Front View: MC392 SMT Pick and Place
WH392 Wafer Handler
MC392 SMT Pick and Place
MC392 SMT Pick and Place Feeder Slot
MC392 SMT Pick and Place Feeders Installed
MC392 SMT Pick and Place Nozzles
MC392 SMT Pick and Place On the Fly Cameras
MC392 SMT Pick and Place Feeder Base
MC392 SMT Pick and Place
MC392 SMT Pick and Place
MC392 SMT Pick and Place

WH392 Wafer Handler

The WH392 is a precision wafer handling system designed for low- to mid-volume semiconductor and microelectronics production. With dual placement heads, 160 configurable smart feeder ports, and integrated wafer handling, the WH392 provides exceptional flexibility for advanced packaging, hybrid circuit assembly, and direct-die applications. It supports components from 01005 chips to large die or packages (up to 100 x 150 mm) with ±30 µm accuracy, making it ideal for high-mix environments with frequent material changes and evolving BOMs.

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Chris Ellis - East Coast

Sales & Operations Manager

215.869.8374

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Sales Manager

215.808.6266

Precision Die Placement & Vision Alignment

Equipped with Cognex® dual-vision systems—one head-mounted for on-the-fly alignment and one upward-looking for large parts—the WH392 delivers micron-level precision for die placement, µBGAs, CSPs, and advanced ICs. Its integrated wafer handler enables direct pickup of known-good-die (KGD) from wafers or gel packs, reducing handling steps and minimizing placement error in sensitive assemblies.

High Material Capacity for Mixed Device Input

Supporting up to 160 smart feeder ports, the WH392 handles wafers, tape, stick, waffle tray, and loose components. Feeder banks are hot-swappable and reconfigurable, allowing seamless transition between semiconductor and SMT-style formats. Operators can pre-stage materials or switch between jobs rapidly—essential for labs, prototyping, and small-batch production.

Optimized Workflow & Software Efficiency

Advanced Windows®-based software integrates CAD import, teach mode, fiducial alignment, and optimization tools. It auto-generates efficient feeder layouts, minimizes head travel, and supports barcode scanning for material traceability. Integration with smart feeders and inventory tools ensures reliable data flow from setup through production.

Built for Throughput & Reliability

With a placement speed of up to 6,400 CPH and a stable, steel unibody construction, the WH392 offers consistent performance across complex assemblies. High-precision ball screw drives and closed-loop AC servo motors ensure durability and repeatability. Optional inline conveyor and remote diagnostics make it production-ready and support-friendly.

Placement Specifications
Number of Placement Heads 2
Placement Rate (IPC-9850)* 5,500 CPH
Placement Rate (Max.) 6,400 CPH
Placement Accuracy 30 µm, 3 Sigma
Minimum Component Size 01005
Maximum Component Size 100 mm x 150 mm (3.94" x 5.9")
Maximum Component Lead Pitch 0.3 mm (0.012")
BGA/CSP Placement Capability Yes - Standard
Alignment Method Dual-Vision Alignment System
Wafer Handling 8-in Wafer Holder
 
Pick Up Specifications
Nozzle Changer Included
Number of Nozzles 14
Accepts Additional Nozzles Yes
Integral Vacuum Yes
 
PCB Specifications
PCB Loading Method Manual (Batch),
3-Stage Inline Conveyor or 2-Stage
Long-Board Conveyor
Maximum Placement Area 350 mm x 600 mm (13.8" x 23.6")
w/o conveyor (stand-alone)
315 mm x 650 mm (12.4" x 25.6")
with inline conveyor
330 x 1200 mm (13" x 47.3")
with 2-stage long-board configuration
Fiducial Recognition / Coordinate Correction Yes
Bad Mark Detection Yes
 
Feeder Capacity
Maximum Number of Feeder Ports 160
Maximum Number of Waffle Trays 1 standard, more optional depending on machine layout
 
Programming
Operating System Windows® Based
PC, Keyboard, Mouse Yes
Monitor Flat LCD
Teaching Camera Yes
Numeric Data Entry Yes
CAD Download Yes
Step and Repeat for Matrix Boards Yes
Bar Code Reader for Feeders & Packaging Yes
MIS and Optimization Functions Yes
Off-Line Programming Yes
Dispenser Specifications
Dispensing Head Optional
Dispense Method Time/Pressure
Dot Size/Placement Speed

Down to 0.5 mm
Up to 6,000 dots/hr

 
Mechanical Specifications
X-Y Axis Drive Mechanism Ball Screw
X-Y Axis Drive Motors AC Servo
X-Y Axis Encoding Rotary
X-Y Axis Resolution 0.005 mm (0.0002")
X-Y Axis Repeatability ±0.01 (10 µm)
Z Axis Drive Motor DC Servo
Z Axis Encoding Rotary
Z Axis Resolution 0.02 mm (0.0008")
θ Axis Drive Motor DC Servo
θ Axis Encoding Rotary
θ Axis Resolution 0.045°
θ Axis Range of Motion 360°
 
Physical Specifications
Overall Dimensions (Approx. L x W x H) 1190 mm L x 1140 mm W x 1346 mm H
(47" x 45" x 53")
Approximate Net Weight 550 Kg (1213 lbs.)
 
Facility Requirements
Standard Voltage 200-230 VAC, 50/60 Hz, 7A
Air Pressure 80 psi, 8 CFM
 
Service and Support
Remote Diagnostics Ethernet
Warranty (Major Components) 1 Year

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