Precision Die Placement & Vision Alignment
Equipped with Cognex® dual-vision systems—one head-mounted for on-the-fly alignment and one upward-looking for large parts—the WH392 delivers micron-level precision for die placement, µBGAs, CSPs, and advanced ICs. Its integrated wafer handler enables direct pickup of known-good-die (KGD) from wafers or gel packs, reducing handling steps and minimizing placement error in sensitive assemblies.
High Material Capacity for Mixed Device Input
Supporting up to 160 smart feeder ports, the WH392 handles wafers, tape, stick, waffle tray, and loose components. Feeder banks are hot-swappable and reconfigurable, allowing seamless transition between semiconductor and SMT-style formats. Operators can pre-stage materials or switch between jobs rapidly—essential for labs, prototyping, and small-batch production.
Optimized Workflow & Software Efficiency
Advanced Windows®-based software integrates CAD import, teach mode, fiducial alignment, and optimization tools. It auto-generates efficient feeder layouts, minimizes head travel, and supports barcode scanning for material traceability. Integration with smart feeders and inventory tools ensures reliable data flow from setup through production.
Built for Throughput & Reliability
With a placement speed of up to 6,400 CPH and a stable, steel unibody construction, the WH392 offers consistent performance across complex assemblies. High-precision ball screw drives and closed-loop AC servo motors ensure durability and repeatability. Optional inline conveyor and remote diagnostics make it production-ready and support-friendly.
Placement Specifications | |
---|---|
Number of Placement Heads | 2 |
Placement Rate (IPC-9850)* | 5,500 CPH |
Placement Rate (Max.) | 6,400 CPH |
Placement Accuracy | 30 µm, 3 Sigma |
Minimum Component Size | 01005 |
Maximum Component Size | 100 mm x 150 mm (3.94" x 5.9") |
Maximum Component Lead Pitch | 0.3 mm (0.012") |
BGA/CSP Placement Capability | Yes - Standard |
Alignment Method | Dual-Vision Alignment System |
Wafer Handling | 8-in Wafer Holder |
Pick Up Specifications | |
Nozzle Changer | Included |
Number of Nozzles | 14 |
Accepts Additional Nozzles | Yes |
Integral Vacuum | Yes |
PCB Specifications | |
PCB Loading Method | Manual (Batch), 3-Stage Inline Conveyor or 2-Stage Long-Board Conveyor |
Maximum Placement Area | 350 mm x 600 mm (13.8" x 23.6") w/o conveyor (stand-alone) 315 mm x 650 mm (12.4" x 25.6") with inline conveyor 330 x 1200 mm (13" x 47.3") with 2-stage long-board configuration |
Fiducial Recognition / Coordinate Correction | Yes |
Bad Mark Detection | Yes |
Feeder Capacity | |
Maximum Number of Feeder Ports | 160 |
Maximum Number of Waffle Trays | 1 standard, more optional depending on machine layout |
Programming | |
Operating System | Windows® Based |
PC, Keyboard, Mouse | Yes |
Monitor | Flat LCD |
Teaching Camera | Yes |
Numeric Data Entry | Yes |
CAD Download | Yes |
Step and Repeat for Matrix Boards | Yes |
Bar Code Reader for Feeders & Packaging | Yes |
MIS and Optimization Functions | Yes |
Off-Line Programming | Yes |
Dispenser Specifications | |
Dispensing Head | Optional |
Dispense Method | Time/Pressure |
Dot Size/Placement Speed |
Down to 0.5 mm |
Mechanical Specifications | |
X-Y Axis Drive Mechanism | Ball Screw |
X-Y Axis Drive Motors | AC Servo |
X-Y Axis Encoding | Rotary |
X-Y Axis Resolution | 0.005 mm (0.0002") |
X-Y Axis Repeatability | ±0.01 (10 µm) |
Z Axis Drive Motor | DC Servo |
Z Axis Encoding | Rotary |
Z Axis Resolution | 0.02 mm (0.0008") |
θ Axis Drive Motor | DC Servo |
θ Axis Encoding | Rotary |
θ Axis Resolution | 0.045° |
θ Axis Range of Motion | 360° |
Physical Specifications | |
Overall Dimensions (Approx. L x W x H) | 1190 mm L x 1140 mm W x 1346 mm H (47" x 45" x 53") |
Approximate Net Weight | 550 Kg (1213 lbs.) |
Facility Requirements | |
Standard Voltage | 200-230 VAC, 50/60 Hz, 7A |
Air Pressure | 80 psi, 8 CFM |
Service and Support | |
Remote Diagnostics | Ethernet |
Warranty (Major Components) | 1 Year |