Efficient Preheating, Fluxing & Conveying

The 16.350 wave soldering system ensures precise and efficient soldering with energy-saving forced hot air convection preheating in a 23.6" (600 mm) glass-covered chamber, delivering uniform heat without the drawbacks of traditional IR heating. If additional preheat time is required, the conveyor can be paused, enhancing process flexibility.

PCBs are transported via an adjustable titanium finger conveyor, where they undergo automated flux application using a reciprocating Y-axis spray fluxing system with a precision spray nozzle, ensuring even and accurate coverage. The variable conveyor speed 500 – 2200mm/min maximizes throughput, while an optional center PCB support rail prevents sagging of oversized boards. Additionally, an automatic finger cleaning system keeps the titanium fingers free of buildup, reducing maintenance and ensuring long-term reliability.

Flexible Dual or Single Wave Operation

The 16.350 wave soldering system supports both dual-wave and single-wave configurations, offering maximum versatility for through-hole and mixed-technology PCB assemblies. The chip wave generates a turbulent crest to ensure thorough solder coverage and eliminate skips, while the main wave efficiently drains excess solder, preventing bridging and accumulation. For non-SMT applications, the chip wave can be easily deactivated via the user interface, allowing for smooth through-hole soldering.

To further optimize soldering performance, the adjustable wave angle allows fine-tuning of the solder flow, ensuring ideal component wetting and minimizing defects like solder icicles or bridging. This feature provides additional control over the soldering process, particularly for complex board designs and varying component densities.

Quick-Connect Secondary Solder Pot for Enhanced Flexibility

For maximum adaptability, the quick-connect secondary solder pot allows fast changeovers between leaded and lead-free solder, significantly reducing downtime and enhancing production efficiency.

The system is designed to support lead-free soldering temperatures up to 300°C and features a high-capacity 440 lbs (200 kg lead-free) solder pot. Its easy roll-out design ensures hassle-free maintenance and cleaning, streamlining the workflow for operators.

To maintain consistent process control and prevent solder-related defects, a built-in alarm alerts operators when the solder level reaches the refill point, ensuring uninterrupted operation and minimizing material waste.

This optimized design enhances both flexibility and reliability, making it ideal for high-mix, high-reliability manufacturing environments.

Optimize Production with Inlet and Unload Conveyors

Manncorp’s WL-100M-L1 Wave Solder Loader and WU-120M-H1 Wave Soldering Belt Unloader are designed to enhance the efficiency and automation of wave soldering processes.

The WL-100M-L1 Wave Solder Loader is a chain-driven inlet conveyor that smoothly feeds assemblies up to 13.78" (350 mm) wide into the wave soldering system. With adjustable travel speed, conveyor angle, and height, it provides flexibility while its sturdy aluminum construction ensures durability and reliability.

For post-soldering handling, the WU-120M-H1 Wave Soldering Belt Unloader features a heat-resistant, non-slip belt that securely transfers soldered assemblies. Its adjustable height, angle, and speed allow for seamless operation, with a speed range of 1.5 to 26.2 ft/min (500 - 800 mm/min) for precise PCB movement to operators or downstream equipment.