Efficient Preheating, Fluxing & Conveying

The 16.350 wave soldering system ensures precise and efficient soldering with energy-saving forced hot air convection preheating in a 23.6" (600 mm) glass-covered chamber, delivering uniform heat without the drawbacks of traditional IR heating. If additional preheat time is required, the conveyor can be paused, enhancing process flexibility.

PCBs are transported via an adjustable titanium finger conveyor, where they undergo automated flux application using a reciprocating Y-axis spray fluxing system with a precision spray nozzle, ensuring even and accurate coverage. The variable conveyor speed 500 – 2200mm/min maximizes throughput, while an optional center PCB support rail prevents sagging of oversized boards. Additionally, an automatic finger cleaning system keeps the titanium fingers free of buildup, reducing maintenance and ensuring long-term reliability.

Flexible Dual or Single Wave Operation

The 16.350 wave soldering system supports both dual-wave and single-wave configurations, offering maximum versatility for through-hole and mixed-technology PCB assemblies. The chip wave generates a turbulent crest to ensure thorough solder coverage and eliminate skips, while the main wave efficiently drains excess solder, preventing bridging and accumulation. For non-SMT applications, the chip wave can be easily deactivated via the user interface, allowing for smooth through-hole soldering.

To further optimize soldering performance, the adjustable wave angle allows fine-tuning of the solder flow, ensuring ideal component wetting and minimizing defects like solder icicles or bridging. This feature provides additional control over the soldering process, particularly for complex board designs and varying component densities.

Quick-Connect Secondary Solder Pot for Enhanced Flexibility

For maximum adaptability, the quick-connect secondary solder pot allows fast changeovers between leaded and lead-free solder, significantly reducing downtime and enhancing production efficiency.

The system is designed to support lead-free soldering temperatures up to 300°C and features a high-capacity 440 lbs (200 kg lead-free) solder pot. Its easy roll-out design ensures hassle-free maintenance and cleaning, streamlining the workflow for operators.

To maintain consistent process control and prevent solder-related defects, a built-in alarm alerts operators when the solder level reaches the refill point, ensuring uninterrupted operation and minimizing material waste.

This optimized design enhances both flexibility and reliability, making it ideal for high-mix, high-reliability manufacturing environments.

Automate Production with Inlet and Unload Conveyors

Manncorp's WL-100M-L1 Wave Soldering Loader inlet conveyor and WU-120M-H1 Wave Soldering Belt Unloader are specifically designed to enhance the efficiency of wave soldering systems.

The WL-100M-L1 Wave Soldering Loader is a fully adjustable, chain-type inlet conveyor that seamlessly feeds assemblies up to 13.78" (350 mm) wide directly into the wave solder machine. It features adjustable travel speed, conveyor angle, and height, all housed in a heavy-duty aluminum construction for durability and reliability.

For post-soldering handling, the WU-120M-H1 Wave Soldering Belt Unloader features a non-slip, heat-resistant belt that safely transfers soldered assemblies from the wave soldering equipment. With adjustable height, angle, and speed, it ensures a smooth and efficient workflow. The speed is variable from 1.5 to 26.2 ft/min (500 - 800 mm/min), allowing for precise control as PCBs move from the wave soldering system to operators or downstream handling equipment.